Automatic Micro Assembly System for picking and placing of components from various presentation formats, as well as for applying adhesives.
Easy to set up, programme and operate, the machine enables manufacturing of technologies like Chip on Board – COB, Multichip Modules – MCM, Chip-on-Chip – COC, Flip Chip and RF Devices etc., using eutectic soldering, sintering, plus other adhesive and die-attach process.
Flexible automatic assembly platform for handling virtually any kind and size of component, as well as for applying adhesives
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,
