The EMU is an automatic Micro Assembly System for picking up and placing of components from various presentation formats, as well as applying adhesives. Typical applications include: manufacturing of prototypes, samples, small series production or process evaluations utilizing micro system technology.
Easy to set up, programme and operate, the machine enables manufacturing of technologies like Chip on Board – COB, Multichip Modules – MCM, Chip-on-Chip – COC, Flip Chip and RF Devices etc., using eutectic soldering, sintering, plus other adhesive and die-attach process.
300 x 350 mm assembly area in the xy axis
Versatile hardware configuration for advanced packaging applications
Options include: toolbox, dispenser, chip eject system, eutectic station and upward looking camera etc.
Short product setup and change-over times
Robust “Linux” based software architecture
Proven user interface, easy to program and operate
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,