K&S

Kulicke & Soffa's (K&S) ball bonders are the leading generation of semiconductor assembly equipment for today's most challenging applications. With our long-standing tradition of innovation and technology leadership, the K&S ball bonders set new standards for performance, productivity, reliability, and ease of use.

ball bonder equipments

Ball Bonder Machine

Highly durable tool for interconnecting bond pads and capable of bonding the finest of wires.

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wire bonder

Battery Bonder Machine

The ultrasonic battery bonders are highly capable machines for today's challenging applications.

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Battery bonder

Die Attach Equipment

Offers wide range of unique and innovative die attach systems based on leading-edge technology.

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die attach machine

Flipchip Bonder

Offers Manual and Semi automated High-speed and High-Precision Flip chip bonder equipment.

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FlipChip Bonder

Inline Solution

Better throughput performance – Higher productivity and efficiency. Superior performance of market leading BB/DA machine.

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LED Bonder

LED Bonder

This device fills fluids with high speed and precision which are apt for manufacturing needs

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Wafer Level Bonder

Wafer Level Bonder

Designed to provide bonding interconnection and package sealing of circuits at the wafer level.

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Wedge Bonder

Wedge Bonder

High-speed wire bonder which caters to industrial needs for best performance and reliability.

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We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,