Our wire bonding, wedge bonding machines are from leading manufacturers in Chennai - INDIA
Power-C™ Wedge Bonder is built specifically for single-row TO package power devices. These bonders are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms. In addition, expanded pattern recognition capabilities deliver industry leading productivity and reliability.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,
