Orthodyne PowerFusionPS Wedge Bonders are driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and reliability. Two models of PowerFusion bonders are available. The TL Model is the perfect choice for bonding TO power devices while the HL Model provides the accuracy and capabilities required to process the most advanced power packages.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,