Power fusion

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Orthodyne PowerFusionPS Wedge Bonders are driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and reliability. Two models of PowerFusion bonders are available. The TL Model is the perfect choice for bonding TO power devices while the HL Model provides the accuracy and capabilities required to process the most advanced power packages.

Key Features

  • Productivity
    • Increased UPH - Enabled with direct-drive servo system and faster PR find times
    • Higher MTBA - Fewer line stoppages with improved pattern recognition
  • Performance
    • Custom looping profiles create specialized loop shapes for critical applications
    • Greater bond placement repeatability
    • Input kicker jam sensor with adjustable force helps prevent lead frame damage
  • Advanced Package Capability
    • Enabler for small power packages
    • Expanded bondable area
    • Wider leadframe capability
    • Superior indexing accuracy
  • Ease of Use
    • Post-bond device review feature
    • Bond tool replacement without gauges
    • Global parameter editing of multiple process programs
  • Configuration Flexibility
    • Link single and dual head machines together
    • Large wire, small wire and PowerRibbon conversion kits available
    • Up to four in-line non-destructive pull testers per head
  • Enquiry Form

We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,