IC Package - Assembly Service

Singulated QFN assembly service (Air cavity)

We provide Singulated Open Cavity QFN package assembly services which is including Die attach, Gold wire bonding, Lid Seal assembly, and Laser Marking.

Available package sizes are from 3x3mm, 4x4mm, 5x5mm, 6x6mm, 7x7mm, 8x8mm QFN in Ceramic, Plastic and Liquid crystal materials for your different requirements.

We do have metal flange packages for high-power RF device requirements.

Please contact us for more information.

Chip on board assembly services (COB)

We provide chip-on-board (COB) assembly services, which include Die attach, gold wire bonding, and glop top.

Our high-speed and high-accuracy bonders can fulfill your manufacturing needs.

Please contact us for more information.