Power-C Wedge Bonder Machine Supplier

wedge bonder supplier

Dedicated Wedge Bonder for Single-Row TO Package

Power-CTM Wedge Bonder is built specifically for single-row TO package power devices. These bonders are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems and wire feeding mechanisms, that are on the PowerFusionTM and AsterionTM platforms. In addition, expanded pattern recognition capabilities deliver industry leading productivity and reliability.

Key Features

Productivity
  • Horizontal Moving Anvil
    • Robust clamping solution for single-row TO application
    • Horizontal Anvil movement supports leads including overhanging leads
    • Clamping scheme similar to Orthodyne M360CHD model
  • Improved MTBA with Enhanced Pattern Recognition
  • Improved Hardware
    • High resolution digital camera
    • Improved Optics - image clarity
    • Co-axial ring light - less susceptible to die tilt
  • Enhanced Pattern Recognition Modes - Feature Find Mode
    • Robust & easy to program
    • Less line stoppages despite surface variations
  • Bond Quality Control and Assessment
    • Multi-segment bonding for enhanced process control on sensitive dies
    • Bonded device review enables visual bond assessment
    • Bond head ALC non-destructive pull test
  • Enquiry Form

We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,