It has large diameter wire/ribbon wedge bonder for use in the production of wide bandgap (WBG) semiconductor-based power modules and the assembly of battery packs.
The Asterion battery Bonder is to play a crucial role in two major electric vehicle (EV) projects in which CIL is extensively involved. In the first, CIL is engaged with BMW on APC15@FutureBEV to maximise potential for future BEV systems. The project is one of 10 projects by the Advanced Propulsion Centre (APC) in its latest round of Government and industry funding for low-carbon emissions research.
In the second case, CIL is the project lead on GaNSiC - a project that stems from the UK Research and Innovation's (UKRI) ‘Driving the Electric Revolution' challenge and brings together CIL and Compound Semiconductor Applications Catapult (CSA Catapult). It is set to develop novel ways of applying Silver Sinter pastes to WBG semiconductors, such as Silicon Carbide (SiC) and Gallium Nitride (GaN) devices, to optimise their thermal coupling and solve complex power module assembly challenges.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,
