The Asterion Wedge Bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. Powerful new software features, like the graphical editor, make programming complex devices easier, and multi-segmented bonding includes flexible tools to deliver an optimized bonding process.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,