Asterion Ev

The AsterionTM EV (Extended Version) Wedge Bonder is built on a reengineered architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together these deliver heightened productivity, bonding quality, and reliability. The enlarged bondable area enhances flexibility and reduces line integration costs. Asterion is driven by a precise new direct-drive motion system that requires minimum maintenance and delivers high repeatability. The graphical editor, multi-segment bonding, global parameter change, and a library of new software features, make programming and optimizing The bonding process of complex devices is relatively easier.

Key Features

• Battery Bonding
  • Compensation for height variations between surfaces
  • Real-time physical testing with the non-destructive pull tester
  • Self-contained/Built-in wire feed dispensing system
  • No heat applied, all work done at ambient temperatures
• Productivity
  • Large bondable area (300 mm x 860 mm) reduces indexing/loading time
  • Resistive touchscreen monitor
• Performance
  • Consistent process results
• Configuration Flexibility
  • Single platform offering a range of interconnect solutions for Al and Cu wires Large wire, small wire and PowerRibbonTM with a wide range of bond head selection
  • Supports multi-device and multi-lane automated handler
• Ease of Use
  • Intuitive Graphical User Interface (Windows 7 OS)
• Maintenance and Reliability - Lower Cost-of-Ownership
  • Highly reliable direct-drive XYZT motion system requires no adjustments and less frequent preventive maintenance.
  • Reduced preventive maintenance requirements on major components.