fab1 is a compact, flexible automatic assembly platform for handling virtually any kind and size of component, as well as for applying adhesives. Typical applications are pick & place, dispensing, sorting, inspection and test functions. Flexibility, easy operation and an extensive range of options, enable the use of standard and advanced packaging technologies like chip on board, multichip modules, chip on chip, flip chip, eutectic soldering processes, as well as the assembly of complex and high quality products. fab1 uses the latest hardware technology, combined with a network transparent fully graphical control software, interacting with a SQL server backend.
Large 500 mm x 430 mm XY working area.
Component presentation in all common forms: Waffle Pack, GEL PAK, Tape Feeder, one Wafer up to 12” or two parallel Wafers up to 8”.
Linux based open software architecture with SQL database and various options.
Versatile hardware configuration with extensive options and possible combinations.
High accuracy motion system with ironcore XY linear motors.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,