The CATAP is an automatic Micro Assembly System for pick and placing of electronic components from various presentation formats, as well as for applying adhesives. Typical applications includes, Manufacturing of prototypes, samples, small-medium production batches or process evaluations utilizing micro system technology.
Utilizing AMADYNE’s advanced software platform with its fully developed process capabilities, the system is quick to program and simple to operate.
300 x 400mm assembly area for the xy axis
Basic system with ironless linear motors and versatile hardware configuration for advanced packaging.
Hardware options like Toolbox, Dispenser, Eutectic station, chip eject system, tape feeder and upward looking camera are available.
Flexible design for fast and easy integration of customer specific requirements
Short product setup and product change times
Robust “Linux” based software architecture
Proven User Interface easy to program and operate
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,