FC701 and FC712 SAC305-88P4 solder paste is a state-ofthe-art lead free no clean solder paste thatpromotes outstanding wetting and minimizessoldering defects. The FC701 flux system isspecifically optimized for lead free alloys, e.g.Sn/Ag/Cu. This formula provides superiorperformance on a variety of surfaces finishesand leaves behind a clear residue.
For demanding complicated electronics appliances such as for smartphones and hybrid electronics devices, the Halogen Zero formulation of the flux is active enough to provide excellent wetting results under Air atmosphere.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,
