Microbond® SMT701 - No Clean Solder Pastes Series is a state of the art lead free solder paste formulation that promotes outstanding printing performance.
For demanding complicated electronics applications such as for smartphones or hybrid electronics, the Halogen Zero formulation of the flux is active enough to provide excellent wetting results under Air atmosphere.
For SMT Applications
Standard Product Specification
Excellent wetting under
air Low voiding
High volume print capability
Anti-solder bead
Transparent residue
Improves head on pillow issue
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,