FC712 Solder Paste

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Microbond® SMT712 - No Clean Solder Pastes Series is a state of the art lead free solder paste formulation that promotes outstanding printing performance.

For demanding complicated electronics applications such as for smartphones or hybrid electronics, the Halogen Zero formulation of the flux is active enough to provide excellent wetting results under Air atmosphere.

Standard Product Specification

  • FC701 Solder Paste
  • No Clean classification
  • Halogen Zero
  • Solder Powder Type 4 & 5
  • ROL0
  • SAC305 Alloy
  • Key Benefits

    Excellent wetting under

    air Low voiding

    High volume print capability

    Anti-solder bead

    Transparent residue

    Improves head on pillow issue

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We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,