Supplier cum Manufacturer in Chennai India

Gold Stud Bump Bonding Wires

Heraeus gold stud bumping wires provide versatility for all types of bumping applications including standard stud. wafers and other materials used in flip-chip and chipto-chip applications

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Gold Bonding wires

Specifically for advanced stud bumping of wafers and other materials used in flip-chip and chipto-chip. Ball Bonding Gold Wires, Wedge Bonding Gold Wires, Stud Bumping Gold Wires

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We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,