Heraeus gold bonding wires are manufactured from highpurity starting materials (99.999%) with doping additions. New applications and their increased requirements led to the development of alloyed gold bonding wires. All wires are corrosion resistant and display a homogeneous chemical composition and stable mechanical properties. The wire surfaces are very clean and of high quality. Gold bonding wires are principally used in the production of plastic packaged components. The highest processing rates are achieved by using the ball / wedge bonding process.
Heraeus offers a wide selection of gold ball bonding wires in a full range of diameters to suit your applications, from high-power and discrete components to high pin-count, ultra-fine pitch devices.
Our wedge bonding gold wires are optimized for tail and loop consistency and provide excellent bondability for high-frequency and opto-electronic applications
Heraeus has developed gold wire products specifically for advanced stud bumping of wafers and other materials used in flip-chip and chipto-chip applications.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,