Heraeus gold stud bumping wires provide versatility for all types of bumping applications including standard stud, coined, and stacked bumps.
Available in either 2N or 4N compositions, it delivers consistent bump height and long-term bond stability
Heraeus has developed gold wire products specifically for advanced stud bumping of wafers and other materials used in flip-chip and chipto-chip applications.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,