X-Ray Inspection(x1200)

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X1200 is specially designed for large-size PCBA, 5G communication board, LED strip etc. Its effective inspection area can reach 1200mm×600mm, supporting customization into automatic inspections.

  • Applications
    • 1200mm×600mm effective inspection area
    • CNC automatically inspection & judgment
    • Support customized services based on different product sizes and inspection plans (optional)
    • User-friendly software, low training cost

APPLICATIONS

  • Organic decontamination and surface activation of lead frames prior to wire bonding
  • Adhesion promoter prior to molding
  • Adhesion promoter of die attach materials on lead frames or PBGA strips
  • Adhesion promoter for flip chip packages prior to underfill
  • Enquiry Form

We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,