Adoption of high performance 355nm UV laser, superior quality for laser beam with tiny spot, suitable for superfine marking.
Selection for rotary double station table and split structure.
Adoption of air-cooling systems under 5W (contained), easy for integration, small size, especially suitable for the flying industry.
Applied to fine marking, precise cutting, and precise processing of special material, mainly used for these materials, such as all kinds of glass, LCDscreen, textiles, chip ceramic, semiconductor, IC grain, sapphire, thin polymer film, etc.
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We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,
