PD 955 M is a thermosetting single component, solvent-free polymer adhesive,developed especially for the surface mounting of SMT components onto PCBs and for use on bare substrates. This rheology is specially adapted for high speed dispensing.
The adhesive dispensing process can be defined as the process of transferring adhesive onto the PCB solder mask in a position suitable for holding the later placed components until the PCB is wave soldered. In some cases, this process is also used to hold heavy components in the second pass of a double-sided reflow process.
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