Rapid

RAPID™ introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications. RAPID™ is a K&S GEN-S Series Automatic Wire Bonder engineered to enable Industry 4.0 communication and is RoHS compliant.

K&S will be demonstrating the capabilities of the RAPID™ architecture in addition to its Asterion™ line of automotive wedge bonding tools at the SEMICON Taiwan trade show from September 23 to 25, 2020 in Taipei.

The Asterion™ wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. The Asterion™ series including the battery bonding models of Asterion™ EV and Asterion™ SV have also received several orders. Together, these features and models have delivered heightened productivity, bonding quality, and proven reliability.