New surface treatment technology to reduce surface wettability, thus significantly retarding the contamination accumulation rate to facilitate for a no-wedge-cleaning process
Applicable on both wire & ribbon applications. Can be offered on any geometry, easy conversion from current wedge with minimum process changes.
Competitor A @30k bonds
Al-Ex @30k bonds
Al-Ex @570k bonds
Standard Ribbon Wedge @30k bonds
Al-Ex Ribbon Wedge @30k bonds
Al-Ex Ribbon Wedge @240k bonds
Reduce labour cost & dependency
a process that is less prone to human error
Improve bonder uptime / productivity / OEE
save on floor space & CE investment
Reduce consumption of cleaning chemical, set screws, QC samples & wedge tool
1st Bond shape @570k bonds with Al-Ex
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,