The iStackTM S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features including the face-down process, In-Situ UV and bond force detection mechanism deliver productivity improvement and performance.
iStack S+ also supports customer’s requirements on automation. It could also be integrated (iStackTM INT) as part of K&S CIS in-line solution.
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,