Overall line length : 6.2m ( setup having 2x wire bonder) excluding Active Alignment System
Addition of 1.19m for incremental wire bonder quantity
SMEMA communication between stations
Value Proposition
Better throughput performance – Higher productivity and efficiency
Modular system
Flexible expansion or removal of line equipment
Easy maintenance
Upgrade of existing machine to In-Line setup
Superior performance of market leading BB/DA machine
High placement accuracy for BB machine
Advance technology in Pick-Transfer-Place algorithm on DA machine
Efficient line management for effective production and line balancing
SMEMA connection between stations. Conveyor controller at wire bonding station for easy implementation
Easy setup without additional programming
Device change over timing of less than 30min
Enquiry Form
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,
