ConnX ELITE

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ConnXPS ELITETM is the latest High Speed Wire Bonder in the industry leading Power Series. Updated motion control systems and the Quick SuiteTM processes deliver maximum productivity and simplified process optimization. ConnXELITE is the new standard in interconnection for Discrete and Low Pin Count packages.

Features

  • Bondable Area of 56 mm x 80 mm
  • ± 3.0 μm accuracy @ 3 sigma
  • New High Speed X-Y-Z motion control and vision systems
  • New proprietary Quick Suite provides robust process performance at maximum UPH
  • Interactive Programmable Look Ahead Vision for ease of set-up for maximum throughput
  • Complete Illumination System with automatic adjustment for PRS robustness
  • Single 2X magnification optics
  • Auto SHTL and NSOL Recovery for improved MTBA performance
  • Auto-BITS self-teach and optimization
  • Dual Frequency transducer allows two selectable frequencies for each bond
  • Enquiry Form

We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,