ATPremier LITE

The ATPremierTM LITE is another extension of the successful Power Series platform. The superior wafer level stud bumping of the ATPremier LITE delivers high productivity with increased eciency.

Higher UPH

• Able to bond up to 200 mm diameter wafers, ceramics or substrates
  • 4" Dual Ramp Chuck Option
• Bond Placement Accuracy
  • ± 3.5 μm @ 3 sigma (200 mm workpiece)
• Power Series Advanced Hardware and Software Controls
• Best-in-Class Low Temperature Gold Bumping
• Improved Serviceability with easy access to the lower console.
• Programmable Power Supply System with back-up
• Upgradeable Capabilities
  • Optional Copper or Silver Alloy capability and kits
• Smallest footprint in the market