Excellent bond-ability control with fine wire diameters
Advanced design rules to maintain 1st & 2nd bond quality over time
Improved process portability and response consistency
Design dynamics to ease the limited copper process window
Consistent performance for smooth production fan-out
Competitive Cost of Ownership
Enhanced workability to help productivity
Improved material wear resistance for challenging processes
Key Attributes
Ultra-fine pitch design fit – Geometrical structure carefully engineered to provide excellent bond-ability and process repeatability
New ITXTM material – Superior properties of advanced processing ceramics, enhances the capillary workability and usable life
High precision key features – Controlled to satisfy the most critical responses of fine copper wire bonding requirements
Enquiry Form
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,
