ACS Max

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ACS MaxTM

ACS MaxTM as part of the ACS series of advanced copper solution capillaries,enables our customers superior copper bonding quality with larger wire diameters and bond pad pitch requirements. The unique design of ACS MaxTM allows a larger bond process window providing dynamic consistency and overall improved bondability throughout its usable life,thereby further reducing wire bonding cost of ownership.

ACS MaxTM Application Range

  • Bond Pad Pitch range: 70-120 [μm]
  • Copper wire diameter range: 0.8-1.3 [mil]
  • Copper wire type: Any
  • Advanced package carrier families, such as Mid pin count QFP, QFN, PPF, μPPF Lead frames

Major Benefits

  • Excellent bond-ability control
    • Advanced design rules to maintain 1st & 2nd bond quality over time
  • Improved process portability and response consistency
    • Design dynamics to ease the limited copper process window
    • Consistent performance for smooth production fan-out
  • Competitive Cost of Ownership
    • Enhanced workability to help productivity
    • Improved material wear resistance for challenging processes
  • Key Attributes

    Improved workability (MTBA) & response consistency especially on 2nd bond performance.

    Higher resistance to wear and more predictable life span

  • Enquiry Form

We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,