ACS LightTM is developed for low-pin count applications, such as discrete & power integrated circuit applications using large wire diameters. ACS LiteTM features new ACS advanced material. With this new product, customers will benefit from excellent bondability, robust consistent process thereby reducing their cost of ownership.
Improved workability (MTBA) & response consistency with large wire bonding performance
Higher resistance to wear and more predictable life span
We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,