ACS Lite

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ACS LightTM

ACS LightTM is developed for low-pin count applications, such as discrete & power integrated circuit applications using large wire diameters. ACS LiteTM features new ACS advanced material. With this new product, customers will benefit from excellent bondability, robust consistent process thereby reducing their cost of ownership.

ACS LightTM Application Range

  • Bond Pad Pitch range: ≥120 [μm]
  • Copper wire diameter range: up to 2.5mil
  • Copper wire type: Any
  • Large pitch package carrier families, such as low pin count lead frames, Power IC and LED

Major Benefits

  • Competitive Cost of Ownership
    • Enhanced workability to improve productivity
    • Improved material wear resistance for challenging processes
  • Key Attributes

    Improved workability (MTBA) & response consistency with large wire bonding performance

    Higher resistance to wear and more predictable life span

  • Enquiry Form

We are semiconductor equipments suppliers in Chennai (INDIA), Singapore and other countries too. Wire bonding machines, Ball bonder machines, Solder pastes, Pick 'n' Place equipments etc.,