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Description
RAPID Pro
First K&S Gen-S Series Automatic wire bonder
RAPID™ Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
Key Features:
- Real-time Process & Performance Monitoring
- Real-time Equipment Health Monitoring
- Advanced Data Analytics & Traceability
- Predictive Maintenance Monitoring & Analysis
- Detection & Enhanced Post bond Inspection
- Most Advanced Response Based Processes
– ProCu-6, ProAu-2, ProAg
– PSP-Cu, PSP-Ag
– ProCu Loop
Bondable Area Configurations:
- RAPID Pro LA (Large Area)
- RAPID Pro ELA (Extended Large Area)
