Description
WSM1200 is designed for measuring the areal and surface of 6” and 8” wafer surface. System comes with one load port, 3-axis Hirata single arm ATM robot, wafer pre-aligner module and mapping sensor to provide higher performance and effective wafer handling. It’s equipped with non-contact type 3D optical profilometer which consists of high technology measurement feature such as Confocal, Interferometry and Ai Focus Variation, along with excellent analysis feature. It’s also integrated with vibration isolation platform to deliver accurate and fast measurement process.
Product Specifications
- Designed for 150mm and 200mm Wafer
- One Load Port for SEMI Std. Open Cassette
- Hirata 3-Axis Single Arm ATM Robot
- Hirata Wafer Pre-aligner for Wafer Orientation Check and Wafer Alignment
- IOSS WID120 OCR Reader
- Sensofar S-Neox Non-Contact Type 3D Optical Profilometer
- Objective Lenses at 10x and 20x
- Vibration Isolation Platform
- TCP/IP Networking For Interface With Host Map Server, and Storage Of Map Data Over The Network
- SECS/GEM Communication Tools (Optional)
