Ultra-High Temperature Inert (Anaerobic) Gas Oven

Ultra-High Temperature Inert (Anaerobic) Gas Oven

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Description

Ultra-High Temperature Inert (Anaerobic) Gas Oven

  • Suitable for curing semiconductor wafers (photoresist PI, PBO, BCB curing), glass substrate baking, and high-precision annealing treatment, etc.
  • Max. working temperature: 360℃, 600℃.
  • Oxygen concentration lower than 20 ppm.

 

Features | Product

The ultra-high temperature anaerobic oven uses a proprietary chamber structure and sealing technology, with excellent temperature uniformity, while also ensuring higher stability and reproducibility. At the same time, the external cooling mechanism circulating by the cooling water can cool down quickly without affecting the atmosphere in the furnace, thus shortening the treatment time.
  • lded and sealed construction assures continuously low air loss
  • Corrosion-resistant, stainless steel (type 304) interior
  • Adjustable inert gas purge system including a flowmeter and supply connection
  • Fiberglass insulation to ensure safe cabinet skin temperature Independent, over-temperature protection
  • Circuit breaker provided for ground fault protection as standard vv
  • High volume horizontal air recirculation system and electric heating system allow for maximum temperature uniformity in performance
  • Excellent reliability and performance ratings

 

Options | Product

Shelves

0

Vacuum Pump

0

HEPA Filter

1

Temperature recorders (paper or paperless)

2(1)

  • Ethernet communications

0

 

Applications | Product

  • Aging
  • Annealing
  • Testing
  • Curing

 

Industries | Product

  • Aerospace
  • Automotive
  • Defense
  • Electronics
  • Research & Development
  • Rubbers & Plastics
  • Semiconductors
  • Telecom
  • Optical Communication

 

Customization | Product

GMS can provide varying levels of uniformity, size, temperature range; if you have a specific tolerance or specification which must be met, please contact us with your requirements so we can ensure the equipment is designed, tested, and adjusted to meet those requirements.

0

 

Product Parameters | Product

Model

GZ-OXY-360C-A

GZ-OXY-360C-B

GZ-OXY-600C-A

GZ-OXY-600C-B

Temp. Range

Room temp. +50~360°C

Room temp. +100~600°C

Control accuracy

+/- 1.0°C

+/- 1.0°C

Temp. Distribution Accuracy

±5°C @360°C (empty load)

±9°C @600°C (empty load)

Interior Dimensions HxWxD(mm)

450x450x450

600x600x600

450x450x450

600x600x600

Exterior Dimensions HxWxD(mm)

1540 x1090 x950

1720×1240 x1100

1750x1240x1010

1900x139x1160

Shelves

2 plates

4 plates

2 plates

4 plates

Workspace Capacity

91L

216L

91L

216L

Cooling System

Water-cooling system

Control System

LCD touch screen with PLC

Safety Device

 Door detector switch, overheat protector, oxygen content monitor, low water pressure detection, low gas pressure detection, fan overload detection, overcurrent ELB etc.

Power Supply

3 phase AC 380V or as request

 

  • Adjustable inert gas purge system including a flowmeter and supply connection
  • Fiberglass insulation to ensure safe cabinet skin temperature
  • Independent, over-temperature protection
  • Circuit breaker provided for ground fault protection as standard
  • High volume horizontal air recirculation system and electric heating system allow for maximum temperature uniformity in performance
  • Excellent reliability and performance ratings

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