Description
RAPID MEM
K&S Gen-S Series Automatic wire bonder
RAPID™ MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.
Key Features:
- Real-time Process & Performance Monitoring
- Real-time Equipment Health Monitoring
- Advanced Data Analytics & Traceability
- Predictive Maintenance Monitoring & Analysis
- Detection & Enhanced Post bond Inspection
- Latest Response Based Processes
– ProAu-2, ProAg-2
– PSP-Ag
– ProOverhang
– Multi-Stitch Bonding
Bondable Area Configurations:
- RAPID MEM LA (Large Area)
- RAPID MEM ELA (Extended Large Area)
