Description
QML-CI is a well-tested inline plasma cleaning system which has been designed to sustain all the demands of a 24/7 continuous inline production environment.
The first QML-CI system was delivered in 2015 with the purpose consistent results in a manufacturing environment. In manufacturing QML-CI is typically used for:
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Plasma cleaning before wire-bonding on modules
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Plasma cleaning before transfer molding on modules
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Plasma cleaning on PCBs, BGA substrates
QML-CI has been used in a range of applications within the Semiconductors and Automotive industries, this applications span from the cleaning and activation of power modules, IGBTs and power MOSFETs.
QML-CI main advantage is its Conveyor-Indexer system which allows the loading and unloading of the plasma chamber in one movement, highly increasing its throughput.
Advanced traceability options are available on this system to easily integrate with a variety of Manufacturing Execution Systems (MES).
Product Specifications
Machine type – Inline plasma cleaner
Footprint – 1460W x 1256L x 1773H mm
Plasma chamber configuration – Two tracks for products carrier
Max product size – Carrier: 200W x 300L x 30H mm (customizable)
Min product size – Carrier: 25W x 100L x 1H mm (customizable)
Plasma generator – 300W RF Generator 13.56 MHz
Automatic tuning system
Gas Lines – 2 Process gas lines with Mass Flow Controller
Pumping system – Dry vacuum pump 1000 L/min
Controller – Win10 LTSC PC with fieldbus
16″ Touchscreen
Proprietary SCI software
Facilities – Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Certifications – CE, S2, S8, Cleanroom ISO7 (10k)
Options – Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 1670 L/min
Traceability package
ISO5 (100) Cleanroom compatibility
Purge line
