Description
QML-2CI is a dual-lane inline plasma cleaning system which has been designed to sustain all the demands of a 24/7 continuous inline production environment where high volumes are top priority.
QML-2CI main advantage is its plasma chamber which allows the loading and unloading of two carriers at the same time in one movement; the two carriers are then processed at the same time highly increasing its throughput.
Advanced traceability options are available on this system to easily integrate with a variety of Manufacturing Execution Systems (MES).
In manufacturing, QML-2CI is typically used for:
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Plasma cleaning before wire-bonding on modules
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Plasma cleaning before transfer molding on modules
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Plasma cleaning on PCBs, BGA substrates
QML-2CI has been used in a range of applications within the Semiconductors and Automotive industries.
Product Specifications
Machine type
Dual-Lane Inline Plasma Cleaner
Footprint
1424W x 1847L x 1636H mm
Plasma chamber configuration
Two tracks for each products carrier
Max product size
Carrier: 200W x 315L x 35H mm (customizable)
Min product size
Carrier: 35W x 100L x 1H mm (customizable)
Plasma generator
600W RF Generator 13.56 MHz
Automatic tuning system
Gas Lines
2 Process gas lines with Mass Flow Controller
Pumping system
Dry vacuum pump 1000 L/min
Controller
Win10 LTSC PC with fieldbus
16″ Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz, 4.8KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Certifications
CE, S2, S8, Cleanroom ISO7 (10k)
Options
Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 1670 L/min
Traceability package
ISO5 (100) Cleanroom compatibility
Purge line
