Description
COST PERFORMANCE WEDGE BONDER FOR POWER DISCRETE APPLICATION
Power-C™ Plus Wedge Bonder is configured specifically to address single and multi-row power discrete applications. Configured for faster order to delivery cycle, these bonders are built based on proven architecture of Power-C and Power Fusion with direct-drive motion systems, ultrasonic generator systems, wire feeding mechanisms and industrial standard communication protocol option.
Key Advantages:
- Supports single and multi-row applications up to 76mm width
- Bond quality control and assessment with non-destructive pull test and in-line pull-test functions
- USB microscope camera enabling viewing and recording images
- Ease of use
- Reduced maintenance and proven field performance
