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Description
MFM 1200L
Bond Tester:
Multifunction Bond Tester
Features:
∙ Powerful software which is easy to operate and control
∙ Built-in SPC function
∙ Multiple data output format
∙ Data processing and failure statistics
∙ Perfectly matched factory net work
Applications:
∙ Bond Tester is widely used in semiconductor packaging, optical communication device packaging, LED packaging, COB/COG process testing, research in mechanics of material in Military Institutions, material reliability testing and other applications.
∙ It is also a crucial dynamic mechanics testing device for SMT process, semiconductor manufacturing process and bonding process.
∙ MFM Tester is able to meet the demand for applications including: Gold wire / copper wire / alloy wire / aluminum wire / aluminum tape pull tests, gold ball / copper ball / tin ball / wafer / chip / SMD Shear tests , tin ball/Bump pin pull tests and so on.
