Description
ADVANCED TECHNOLOGY WAFER LEVEL BONDER
The ATPremierPS PLUS™ is another extension of the successful Power Series platform. The superior wafer level stud bumping and wire bonding of the ATPremier PLUS delivers high productivity with increased efficiency.
Key Features
- Able to Bond up to 300 mm Diameter Wafers, Ceramics or Substrates
- Bond Placement Accuracy
– ±3.5µm @3 sigma (200mm Work Piece)
– ±5.0µm @3 sigma (300mm Work Piece) - Power Series Advanced Hardware and Software Controls
- Best-in-Class Low Temperature Gold Bumping
- Improved Serviceability with Easy Access to Lower Console
- Programmable Power Supply System with Back-Up
- Upgradeable Capabilities
– Optional Copper or Silver Alloy Capability and Kits
– Optional Basic Wire Bonding Capability - Smallest Footprint in the Market