AT PREMIER PLUS


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Description

ADVANCED TECHNOLOGY WAFER LEVEL BONDER 

The ATPremierPS PLUS™ is another extension of the successful Power Series platform. The superior wafer level stud bumping and wire bonding of the ATPremier PLUS delivers high productivity with increased efficiency.

Key Features

  • Able to Bond up to 300 mm Diameter Wafers, Ceramics or Substrates
  • Bond Placement Accuracy
    – ±3.5µm @3 sigma (200mm Work Piece)
    – ±5.0µm @3 sigma (300mm Work Piece)
  • Power Series Advanced Hardware and Software Controls
  • Best-in-Class Low Temperature Gold Bumping
  • Improved Serviceability with Easy Access to Lower Console
  • Programmable Power Supply System with Back-Up
  • Upgradeable Capabilities
    – Optional Copper or Silver Alloy Capability and Kits
    – Optional Basic Wire Bonding Capability
  • Smallest Footprint in the Market