Description
JAP-3100
Features:
- After inserting multiple wafers into the magazine, automatic loading is performed, and vision inspection is followed by automatic pick and place
- Motion control is differentiated from existing equipment with 11-axis servo motor and linear motion guide system
- Ultra-precision positioning with an accuracy of 0.01 mm through incremental positioning
- Improved speed and accuracy by using single head 2-para
- High-speed pick and place is possible
- Wafer to tray process (small device)
