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Description
Dicing Blade – HCL
HCL Hub Blades series provides a competitive solution to general silicon wafer dicing for quality, precision and CoO improvement by delivering superior product quality and value added features.
Key Features:
Enhanced Solution for Single & Step Cut Dicing Processes
New Hub Design to Enable High Spindle Frequency Application
Standardized Part Number Choice as Universal Solution
Shiny Bub with Enhanced Visual Control
Additional information
| Color | Green |
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