Description
K&S BONDER-CAPILLARY PROVEN SOLUTION BENEFITS
For Various IC Packaging Challenges Associated with
- Interconnect for high density packages on wafer or substrate
- Electromagnetic interference (EMI) shielding for RF devices
The ProVertical Loop Process Enables
- Vertically bonded wires per requirements – Target Wire Height & Form Angle
- Minimized wire-to-wire pitch – No second bond knicking on substrate or wafer
- Reduced capillary-wire interference risk – Robust process linked to capillary geometry
- Improved overall process yield – Productivity (UPH) improvement of up to 5%
The Vertical Wire Bonding Capillary
- Design optimized – per package constrains (access restrictions, breakage risk) and physical properties (material, geometrical)
- Performance predicted – by design configurator specifically developed for vertical wire formation process
