Description
Plasma Surface Treatment Machine
The equipment is mainly composed of vacuum chamber and high frequency plasma power supply, vacuum system, inflation system, automatic control system and other parts. The basic principle of the work is in a vacuum state, the use of vacuum pumps to vacuum the studio to achieve a vacuum of 0.15-0.3 mbar, and then in the role of high-frequency generator, the gas will be ionized, the formation of plasma (the fourth state of matter), and then the use of plasma on the surface of the workpiece treatment.
- Plasma system-handing machine
- It can be used consistently in a manufacturing environment to clean and activate the surface of oddly shaped parts
- Vacuum chamber
FEATURES | Product
The remarkable feature of the plasma state is the high uniformity of the glow discharge, which emits visible light in colors ranging from blue to deep purple depending on the gas, and the material is treated at temperatures close to room temperature. These highly active microparticles interact with the treated surface to obtain a variety of surface modifications such as surface hydrophilicity, water repellency, low friction, high cleanliness, activation, etching, and so on.
- In semiconductor processing, plasma cleaning is commonly used to prepare a wafer surface prior to wire bonding. Removing contamination (flux) strengthens the bond adhesion, which helps extend device reliability and longevity.
- In biomedical applications, plasma cleaning is useful for achieving compatibility between synthetic biomaterials and natural tissues. Surface modification minimizes adverse reactions such as inflammation, infection, and thrombosis formation.
Parameters | Product
|
Model |
GZ-DZ-PT3000 |
|
Size |
|
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Machine Size |
W1250mm*D1150mm*H2020mm with alarm light) |
|
Weight |
550kg |
|
Chamber |
|
|
Material |
Nickel-coated aluminum |
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Inner cavity size |
W500*D600*H500mm |
|
Volume |
150L |
|
Shelves |
W450*D500, 6 layers |
|
Vacuum System |
|
|
Vacuum pump output power |
dry pump |
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Vacuum Indicator |
1.0×10^5 ～1×10^-1 Pa |
|
Process pressure range |
10-100pa |
|
Vacuum extraction time |
≤100s |
|
Gas Lines |
|
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Process gas type |
Argon, Nitrogen, or others |
|
Gas Input |
2 inputs, more can be add as requested |
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RF Generator |
|
|
RF output power |
1000W |
|
RF Frequency |
RF 13.56MHZ, power 1000W can be set |
|
Controller |
|
|
Control |
PLC+ 8 inch Interface |
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Standards |
RS485 or RS232 communication or as request Clean room ready CE |
Applications | Product
- Wire bond surface preparation on modules.
- Cleaning before transfer molding on modules or underfilling.
- Surface treatment for PCB or BGA substrates.
- Removing contaminants (flux) or sterilizing a surface.
- Promoting adhesion between two surfaces.
- Controlling surface tension to achieve either a hydrophobic or hydrophilic surface.
- Increasing biocompatibility.
- Improving polymer performance through cross-linking to decrease friction that wears out devices.