Ultra-High Temperature Inert (Anaerobic) Gas Oven

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Description

Ultra-High Temperature Inert (Anaerobic) Gas Oven

Suitable for curing semiconductor wafers (photoresist PI, PBO, BCB curing), glass substrate baking, and high-precision annealing treatment, etc.

  • Max. working temperature:360℃, 600℃.
  • Oxygen concentration lower than:20 ppm

 

FEATURES | Product

The ultra-high temperature anaerobic oven uses a proprietary chamber structure and sealing technology, with excellent temperature uniformity, while also ensuring higher stability and reproducibility. At the same time, the external cooling mechanism circulating by the cooling water can cool down quickly without affecting the atmosphere in the furnace, thus shortening the treatment time.

  • Approved for Argon, Carbon Dioxide, Helium, and Nitrogen inert gases.
  • Unique inner/outer shell chamber allows coolant ambient air to circulate around an inert gas inner chamber.
  • Water-Cooled Door with silicon sealing.
  • Temperature can rise or fall quickly, and the rise or fall rate can be adjustable.
  • All welded and sealed construction assures continuously low air loss.
  • Corrosion-resistant, stainless steel (type 304) interior.
  • Adjustable inert gas purge system including a flowmeter and supply connection.
  • Fiberglass insulation to ensure safe cabinet skin temperature.
  • Independent, over-temperature protection.
  • Circuit breaker provided for ground fault protection as standard.
  • High volume horizontal air recirculation system and electric heating system allow for maximum temperature uniformity in performance.
  • Excellent reliability and performance ratings.

 

Parameters | Product

Model

GZ-OXY-500C-A

GZ-OXY-500C-B

Temp. Range

Room temp. +100~600°C

Control accuracy

+/- 1.0°C

Temp. Distribution Accuracy

±1.5%°C  (empty load)

Temp. Rising Time

About 60min (Room temp.→550°C). empty chamber

Cooling Speed

About 60min (550°C→80°C). empty chamber

Operation Function

Optional for fixed temp. or program operation

Interior Dimensions HxWxD

500x500x500(mm)

600x600x600(mm)

Exterior Dimensions HxWxD

1840x1200x1000 (mm)

1850x1300x1100(mm)

Workspace Capacity

125L

216L

Cooling System

Water-cooling system

 

Options | Product

Temperature recorders (paper or paperless)6gj

Shelves

HEPA Filteryfl

Temperature recorders (paper or paperless)

Vacuum Pump7w6

Programmable controller, Ethernet, and USB communications

shelves737

Clean room packaging for shipment and installation

Ethernet communicationsg7f

Data logging and trending

 

Applications | Product

  • Aging
  • Annealing
  • Testing
  • Curing

 

Industries | Product

  • Aerospace
  • Automotive
  • Defense
  • Electronics
  • Research & Development
  • Rubbers & Plastics
  • Semiconductors
  • Telecom
  • Optical Communication

 

Customization | Product

GMS can provide varying levels of uniformity, size, temperature range, vacuum and automatic functions; if you have a specific tolerance or specification which must be met, please contact us with your requirements so we can ensure the equipment is designed, tested, and adjusted to meet those requirements.

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