Description
Double Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices – MVP Aurora:
Double Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices – MVP Aurora:
Key Features:
- Dual Technology Inspection – 2D and 3D
- Multi-side Inspection
- Coplanarity
- Package Dimensions
- Part Marking and Surface Inspection
- Other components including SMT
- Packaged ICs
- BGAs – Area Array Packages
- Leaded Devices
Capabiliities:
- Jedec Tray
- Same Side In-Out Loader
- SECS/GEM
- XML Map Output for Downstream Sorting
