Description
Single Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices – MVP Aura:
Single Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices – MVP Aura:
Key Features:
- Dual Technology Inspection – 2D and 3D
- Single-side Inspection
- Full Inspection: Height, Position, Metrology and Coplanarity Measurements
- In-Line JEDEC Tray Handling
- Sorting to Defect Tray
- Interchangeable Vacuum Nozzles for Large and Small Packages
- No Part Size Constraints
- Inspect Parts Independent of Size
- Small Footprint
Capabiliities:
- Jedec Tray
- In Line or Same Side In-Out Loader
- SECS/GEM
- XML Map Output for Downstream Sorting
