Description
In Tray BGA and Sensor Inspection – MVP 900 T/TS:
In Tray BGA and Sensor Inspection – MVP 900 T/TS:
Key Features (BGA):
- 2D and 3D Capable
- Ball Height – Referenced to Substrate
- Coplanarity
- Offset and Position
- Diameter
- Damage
- Shape
- Edge and Surface
- Package Metrology
Key Features (Sensors):
- Package Dimensions
- Foreign Material/Debris
- Contamination
- Scratches/Cracks
- Package Metrology
Options:
- Jedec Tray
- Waffle Pack
- Same Side In-Out Loader
- Loader to Unloader Handling
- SECS/GEM
- XML Map Output for Downstream Sorting
- Ink Marking for Defect Locations
