Description
Die and Wire Bond Inspection – MVP 900 DWMS:
Die and Wire Bond Inspection – MVP 900 DWMS:
Key Features:
- 3 Stage Conveyor System
- Dual Sided Load/Unload
- Strips Lead-frames Auer boats, J-Boats, Trays
- Die Placement Metrology
- Die Surface, Edge Crack Detection
- Epoxy Spread and Flow Measurement
- Au, Al, Ag, and Cu Wires to 1um Resolution
- Wedge, Ball, and Stitch Wire Bonds
- Crescent, and Tape Bonds
- SMT Components
Options:
- High Resolution Laser Profiler
- 12 or 25 MP Camera
- AutoWidth
- Vacuum
- SECS/GEM
- XML Map Output for Downstream Sorting
- Ink Marking on Optics Head for Defect Locations
