Description
Dice Wafer Inspection (Film Frame) – MVP 900 DW/ADW:
Dice Wafer Inspection (Film Frame) – MVP 900 DW/ADW:
Key Features:
- 2D and 3D Capable
- Up to 300mm Film Frame
- 0.35um to > 3.4um Optical Resolution
- Multi-Spectral Lighting
- Real-Time Process Monitoring
- Ease of Use Inspection Recipe Generation
- Standard Wafers and Multi Project Wafers Supported
Options:
- High Resolution Laser Profiler
- Manual Loading
- Automatic Film Frame Cassette Loading
- Film Frame Vacuum or Support Plate
- Film Frame Flipper for Under Film Inspection
- SECS/GEM
- XML Map Output for Downstream Sorting
- Ink Marking for Defect Locations
