Description
Eagle X5065C
Features:
- This equipment is a cutting-only equipment using UV Laser, and it is a device that performs Half Cutting or Full Cutting of materials such as Pi Film, Coverlay, PCB, FPCB, RF-PCB, SLP, PPG, copper foil, gold foil, etc.
- Cutting Application by UV Wavelength
- (RF), (F), PCB / SLP / Coverlay / Pi Film ETC
- Beam Spot Size Control: Max 25㎛ ~
- Max. Cutting Speed: 3,000㎜/Sec
- Cutting Accuracy: ±10㎛(Average)
- 2D On The Fly + Step processing (Highest speed cutting possible)
- Work Field: 650 * 650 (mm) and User define.
- Option: Laser Power Auto Offset
